JPS6311735Y2 - - Google Patents

Info

Publication number
JPS6311735Y2
JPS6311735Y2 JP10586283U JP10586283U JPS6311735Y2 JP S6311735 Y2 JPS6311735 Y2 JP S6311735Y2 JP 10586283 U JP10586283 U JP 10586283U JP 10586283 U JP10586283 U JP 10586283U JP S6311735 Y2 JPS6311735 Y2 JP S6311735Y2
Authority
JP
Japan
Prior art keywords
heat sink
power transistor
integrated circuit
hybrid integrated
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10586283U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6013745U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10586283U priority Critical patent/JPS6013745U/ja
Publication of JPS6013745U publication Critical patent/JPS6013745U/ja
Application granted granted Critical
Publication of JPS6311735Y2 publication Critical patent/JPS6311735Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10586283U 1983-07-06 1983-07-06 混成集積回路 Granted JPS6013745U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10586283U JPS6013745U (ja) 1983-07-06 1983-07-06 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10586283U JPS6013745U (ja) 1983-07-06 1983-07-06 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6013745U JPS6013745U (ja) 1985-01-30
JPS6311735Y2 true JPS6311735Y2 (en]) 1988-04-05

Family

ID=30247967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10586283U Granted JPS6013745U (ja) 1983-07-06 1983-07-06 混成集積回路

Country Status (1)

Country Link
JP (1) JPS6013745U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2536626Y2 (ja) * 1988-08-12 1997-05-21 三洋電機株式会社 混成集積回路

Also Published As

Publication number Publication date
JPS6013745U (ja) 1985-01-30

Similar Documents

Publication Publication Date Title
CN1127202C (zh) 电子器件及其制造方法
JPH06177295A (ja) 混成集積回路装置
JPS6311735Y2 (en])
JPS6233330Y2 (en])
JPH07263618A (ja) 混成集積回路装置
JP2579222Y2 (ja) 樹脂封止型回路装置
JPH02278752A (ja) 半導体装置
JPH03280453A (ja) 半導体装置及びその製造方法
JPH09246433A (ja) モジュールの放熱構造
JP2515515Y2 (ja) 電子機器
JPH0410742B2 (en])
JPH0561780B2 (en])
JPS622775Y2 (en])
JP2551349B2 (ja) 樹脂封止型半導体装置
JPH025539Y2 (en])
JPS629730Y2 (en])
JPH0412677Y2 (en])
JPS6311733Y2 (en])
JPH0636589Y2 (ja) 樹脂封止型電子機器
JPH0353779B2 (en])
JP2906635B2 (ja) 混成集積回路装置
JPS6239036A (ja) ハイブリツドｉｃ
JPH0338746B2 (en])
JPS6328607Y2 (en])
JPS629729Y2 (en])